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datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/27 tsz02201-0rar0g200690-1-2 ? 2014 rohm co., ltd. all rights reserved. 30.jan.2014 rev.001 tsz22111 14 001 www.rohm.com operational amplifier ground sense operational amplifiers ba2904yf-lb ba2902yf-lb general description this is the product guarantees long time support in industrial market. ba2904yf-lb and ba2902yf-lb are operational amplifiers that can operate in single power supply. it features low power consumption, input common-mode voltage range includes ground, and can operate from +3v to +36v. applications are car navigation system, car audio, automotive body and exteriors. features ? long time support a product for industrial applications ? single or dual power supply operation ? wide operating supply voltage ? common-mode input voltage range includes ground level ? low supply current ? wide temperature range key specifications ? operating supply voltage single supply : +3.0v to +36v dual supply : 1.5v to 18v ? supply current ba2904yf-lb (dual) 0.5ma(typ) ba2902yf-lb (quad) 0.7ma(typ) ? input bias current : 20na(typ) ? input offset current : 2na(typ) ? operating temperature range : -40c to +125c packages w(typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm sop14 8.70mm x 6.20mm x 1.71mm applications ? industrial equipment ? current sense application ? buffer application amplifier ? active filter simplified schematic figure 1. simplified schematic (1 channel only) in in out vcc vee downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 2/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 c + - c - + - + cc + - ee c - + + - c - + + - pin configuration ba2904yf-lb : sop8 pin no. pin name 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc ba2902yf-lb : sop14 pin no. pin name 1 out1 2 -in1 3 +in1 4 vcc 5 +in2 6 -in2 7 out2 8 out3 9 -in3 10 +in3 11 vee 12 +in4 13 -in4 14 out4 sop8 sop14 ba2904yf-lb ba2902yf-lb -+ + - ch1 ch2 8 1 23 4 5 6 7 out1 -in1 +in1 vee vcc out2 -in2 +in2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 3/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 ordering information b a 2 9 0 x y f - lb h2 parts number ba2904yf ba2902yf package f : sop8 sop14 product class lb for industrial applications packaging and forming specification h2: embossed tape and reel (sop8/sop14) line-up topr supply voltage number of channels package orderable part number -40c to +125c +3v to +36v dual sop8 reel of 250 ba2904yf-lbh2 quad sop14 reel of 250 BA2902YF-LBH2 absolute maximum ratings (t a =25 c ) parameter symbol ratings unit ba2904yf-lb ba2902yf-lb supply voltage vcc-vee +36 v power dissipation p d sop8 0.77 (note 1,3) - w sop14 - 0.56 (note 2,3) differential input voltage (note 4) v id +36 v input common-mode voltage range v icm (vee-0.3) to (vee+36) v input current (note 5) i i -10 ma operating supply voltage v opr +3.0 to +36 (1.5 to 18) v operating temperature range t opr -40 to +125 c storage temperature range t stg -55 to +150 c maximum junction temperature t jmax +150 c (note 1) to use at temperature above t a =25c reduce 6.2mw/c. (note 2) to use at temperature above t a =25c reduce 4.5mw/c. (note 3) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 4) the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. (note 5) an excessive input current will flow when input voltages of less than vee-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 4/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 electrical characteristics ba2904yf-lb (unless otherwise specified vcc=+5v, vee=0v) (note 6) absolute value (note 7) full range t a =-40c to +125c (note 8) current direction: since first input stage is compos ed with pnp transistor, input bias current flows out of ic. (note 9) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted th e output current reduces the internal temperature by flushing. parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 6,7) v io 25c - 2 7 mv e k =-1.4v full range - - 10 vcc=5 to 30v, e k =-1.4v input offset voltage drift v io / t - - 7 - v/c e k =-1.4v input offset current (note 6,7) i io 25c - 2 50 na e k =-1.4v full range - - 200 input offset current drift i io / t - - 10 - pa/c e k =-1.4v input bias current (note 7,8) i b 25c - 20 250 na e k =-1.4v full range - - 250 supply current (note 7) i cc 25c - 0.5 1.2 ma r l = , all op-amps full range - - 2 maximum output voltage(high) (note 7) v oh 25c 3.5 - - v r l =2k ? full range 27 28 - vcc=30v, r l =10k ? maximum output voltage(low) (note 7) v ol full range - 5 20 mv r l = , all op-amps large signal voltage gain a v 25c 25 100 - v/mv r l 2k ? , vcc=15v e k =-1.4v to -11.4v 88 100 - db input common-mode voltage range v icm 25c 0 - vcc-1.5 v (vcc-vee)=5ve k =vee-1.4v common-mode rejection ratio cmrr 25c 50 80 - db e k =-1.4v power supply rejection ratio psrr 25c 65 100 - db vcc=5 to 30v output source current (note 7,9) i source 25c 20 30 - ma +in=1v, -in=0v out=0v, short current full range 10 - - output sink current (note 7,9) i sink 25c 10 20 - ma +in=0v, -in=1v out=5v, short current full range 2 - - 25c 12 40 - a +in=0v, -in=1v out=200mv slew rate sr 25c - 0.2 - v/ s vcc=15v, a v =0db r l =2k ? , c l =100pf gain bandwidth product gbw 25c - 0.5 - mhz vcc=30v, r l =2k ? c l =100pf input referred noise voltage v n 25c - 40 - hz nv/ vcc=15v, vee=-15v a v =40db, v icm =0v r s =100 ? , f=1khz channel separation cs 25c - 120 - db a v =40db, f=1khz out=0.5vrms downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 5/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 electrical characteristics ba2902yf-lb (unless otherwise specified vcc=+5v, vee=0v) (note 10) absolute value (note 11) full range t a =-40c to +125c (note 12) current direction: since first input stage is compos ed with pnp transistor, input bias current flows out of ic. (note 13) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted th e output current reduces the internal temperature by flushing. parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 10,11) v io 25c - 2 7 mv e k =-1.4v full range - - 10 vcc=5 to 30v, e k =-1.4v input offset voltage drift v io / t - - 7 - v/c e k =-1.4v input offset current (note 10,11) i io 25c - 2 50 na e k =-1.4v full range - - 200 input offset current drift i io / t - - 10 - pa/c e k =-1.4v input bias current (note 11,12) i b 25c - 20 250 na e k =-1.4v full range - - 250 supply current (note 11) i cc 25c - 0.7 2 ma r l = , all op-amps full range - - 3 maximum output voltage(high) (note 11) v oh 25c 3.5 - - v r l =2k ? full range 27 28 - vcc=30v, r l =10k ? maximum output voltage(low) (note 11) v ol full range - 5 20 mv r l = , all op-amps large signal voltage gain a v 25c 25 100 - v/mv r l 2k ? , vcc=15v e k =-1.4v to -11.4v 88 100 - db input common-mode voltage range v icm 25c 0 - vcc-1.5 v (vcc-vee)=5ve k =vee-1.4v common-mode rejection ratio cmrr 25c 50 80 - db e k =-1.4v power supply rejection ratio psrr 25c 65 100 - db vcc=5 to 30v output source current (note 11,13) i source 25c 20 30 - ma +in=1v, -in=0v out=0v, short current full range 10 - - output sink current (note 11,13) i sink 25c 10 20 - ma +in=0v, -in=1v out=5v, short current full range 2 - - 25c 12 40 - a +in=0v, -in=1v out=200mv slew rate sr 25c - 0.2 - v/ s vcc=15v, a v =0db r l =2k ? , c l =100pf gain bandwidth product gbw 25c - 0.5 - mhz vcc=30v, r l =2k ? c l =100pf input referred noise voltage v n 25c - 40 - hz nv/ vcc=15v, vee=-15v a v =40db, v icm =0v r s =100 ? , f=1khz channel separation cs 25c - 120 - db a v =40db, f=1khz out=0.5vrms downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 6/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 description of electrical characteristics described below are descriptions of the rele vant electrical terms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning ma y differ from those on another manufacturers document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cau se deterioration of characteristics. (1) supply voltage (vcc/vee) indicates the maximum voltage that can be applied betwe en vcc and vee without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied betw een non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratin gs does not assure normal operation of ic. for normal operation, use the ic within the input co mmon-mode voltage range characteristics. (4) operating and storage temperature ranges (t opr , t stg ) the operating temperature range indicate s the temperature range within which the ic can operate. the higher the ambient temperature, the lower the po wer consumption of the ic. the storage temperature range denotes the range of temperatures the ic can be stored und er without causing excessive deterioratio n of the electrical characteristics. (5) power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient temperature 25c (normal temperature). as for package product, p d is determined by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics (1) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. (2) input offset voltage drift ( v io / t) denotes the ratio of the input offset voltage fluc tuation to the ambient te mperature fluctuation. (3) input offset current (i io ) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. (4) input offset current drift ( i io / t) denotes the ratio of the input offset current fluc tuation to the ambient te mperature fluctuation. (5) input bias current (i b ) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (6) supply current (i cc ) indicates the current that flows within the ic under specified no-load conditions. (7) maximum output voltage(high) / maximum output voltage(low) (v oh /v ol ) indicates the voltage range of the output under specif ied load condition. it is typically divided into high-level output voltage and low-level output voltage. high-level output voltage indicates the upper limit of output voltage while low-level output voltage indicates the lower limit. (8) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. a v = (output voltage) / (differential input voltage) (9) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 7/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 (10) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode vo ltage) / (input offset fluctuation) (11) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volta ge) / (input offset fluctuation) (12) output source current/ output sink current (i source / i sink ) the maximum current that c an be output from the ic under specific output conditions. the output source current indicates the current flowing out from the ic, and the output sink current indica tes the current flowing into the ic. (13) slew rate (sr) indicates the ratio of the change in output voltage wi th time when a step input signal is applied. (14) gain bandwidth product (gbw) the product of the open-loop voltage gai n and the frequency at which the voltage gain decreases 6db/octave. (15) input referred noise voltage (v n ) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. (16) channel separation (cs) indicates the fluctuation in the output vo ltage of the driven channel with reference to the change of output voltage of the channel which is not driven. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 8/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 figure 3. supply current vs supply voltage figure 4. supply current vs ambient temperature figure 5. maximum output voltage(high) vs supply voltage (r l =10k ? ) figure 2. derating curve typical performance curves ba2904yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] supply current [ma] 0 10 20 30 40 0 1 02 03 04 0 supply voltage [v] maximum output voltage(high) [v] 25 125 -40 3v 5v 25 -40 125 32v 36v 0.0 0.2 0.4 0.6 0.8 1.0 0 1 02 03 04 0 supply voltage [v] supp ly current [ma] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] . ba2904yf-lb downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 9/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 figure 6. maximum output voltage(high) vs ambient temperature (vcc=5v, r l =2k ? ) figure 7. output source current vs output voltage (vcc=5v) figure 8. output source current vs ambient temperature (out=0v) figure 9. output sink current vs output voltage (vcc=5v) ba2904yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. -40 25 125 15v 3v 5v 0 10 20 30 40 50 012345 output voltage[v] output source current [ma] 0.001 0.01 0.1 1 10 100 0 0.4 0.8 1.2 1.6 2 output voltage [v] output sink current [ma] 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output source current [ma] 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] max imu m outpu t voltage(high ) [v] -40 25 125 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 10/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 figure 10. output sink current vs ambient temperature ( out=vcc ) figure 11. low level sink current vs supply voltage (out=0.2v) figure 12. low level sink current vs ambient temperature (out=0.2v) figure 13. input offset voltage vs supply voltage (v icm =0v, e k =-1.4v) ba2904yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. -8 -6 -4 -2 0 2 4 6 8 0 5 10 15 20 25 30 35 supply voltage [v] input offset voltage [mv] 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 supplly voltage [v] low - level sink current [a] 3v 5v 15v -40 125 25 5v 3v -40 25 125 32v 36v 0 10 20 30 40 50 60 70 80 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] low - level sink current [a] 0 10 20 30 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output sink current [ma] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 11/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 ba2904yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. -8 -6 -4 -2 0 2 4 6 8 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input offset voltage [mv] 0 10 20 30 40 50 0 5 10 15 20 25 30 35 supply voltage [v] input bias current [na] figure 17. input bias current vs ambient temperature (vcc=30v, v icm =28v, e k =-1.4v) figure 14. input offset voltage vs ambient temperature (v icm =0v, e k =-1.4v) figure 15. input bias current vs supply voltage (v icm =0v, e k =-1.4v) figure 16. input bias current vs ambient temperature (v icm =0v, e k =-1.4v) 3v 5v 125 -40 25 3v 5v 32v 36v 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input bias current [na] -10 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input bias current [na] 36v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 12/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 ba2904yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. -10 -5 0 5 10 0 5 10 15 20 25 30 35 supply voltage [v] input offset current [na] -10 -5 0 5 10 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input offset current [na] -8 -6 -4 -2 0 2 4 6 8 - 1012345 input voltage [v] input offset voltage [mv] figure 19. input offset current vs supply voltage (v icm =0v, e k =-1.4v) figure 18. input offset voltage vs input voltage (vcc=5v) figure 20. input offset current vs ambient temperature (v icm =0v, e k =-1.4v) figure 21. large signal voltage gain vs supply voltage (r l =2k ? ) -40 25 125 -40 25 125 3v 5v 60 70 80 90 100 110 120 130 140 4 6 8 10 12 14 16 supply voltage [v] large signal voltage gain [db] -40 25 125 36v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 13/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 ba2904yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. 40 60 80 100 120 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] common mode rejection ratio [db] 40 60 80 100 120 140 01 02 03 04 0 supply voltage [v] common mode rejection ratio [db] figure 22. large signal voltage gain vs ambient temperature (r l =2k ? ) figure 23. common mode rejection ratio vs supply voltage figure 24. common mode rejection ratio vs ambient temperature figure 25. power supply rejection ratio vs ambient temperature -40 125 25 5v 3v 32v 36v 60 70 80 90 100 110 120 130 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] large signal voltage gain [db] 60 70 80 90 100 110 120 130 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] power supply rejection ratio [db] 5v 15v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 14/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 figure 27. supply current vs supply voltage figure 28. supply current vs ambient temperature figure 29. maximum output voltage(high) vs supply voltage (r l =10k ? ) figure 26. derating curve ba2902yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. 0.0 0.4 0.8 1.2 1.6 2.0 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] supply current [ma] 0.0 0.4 0.8 1.2 1.6 2.0 0 1 02 03 04 0 supply voltage [v] supply current [ma] 25 125 -40 25 -40 125 0.0 0.2 0.4 0.6 0.8 1.0 02 55 07 51 0 01 2 51 5 0 ambient temperature [c] power dissipation [w] 0 10 20 30 40 0 1 02 03 04 0 supply voltage [v] maximum output voltage(high) [v] ba2902yf-lb 3v 5v 32v 36v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 15/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 figure 30. maximum output voltage(high) vs ambient temperature (vcc=5v, r l =2k ? ) figure 31. output source current vs output voltage (vcc=5v) figure 32. output source current vs ambient temperature (out=0v) figure 33. output sink current vs output voltage (vcc=5v) ba2902yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. 0 10 20 30 40 50 012345 output voltage[v] output source current [ma] 15v 3v 5v 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output source current [ma] 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] max imu m outpu t voltage(high ) [v] -40 25 125 0.001 0.01 0.1 1 10 100 0 0.4 0.8 1.2 1.6 2 output voltage [v] output sink current [ma] -40 25 125 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 16/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 figure 34. output sink current vs ambient temperature ( out=vcc ) figure 35. low level sink current vs supply voltage (out=0.2v) figure 36. low level sink current vs ambient temperature (out=0.2v) figure 37. input offset voltage vs supply voltage (v icm =0v, out=1.4v) ba2902yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. -40 125 25 5v 3v -40 25 125 32v 36v 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 supplly voltage [v] low - level sink current [a] -8 -6 -4 -2 0 2 4 6 8 0 5 10 15 20 25 30 35 supply voltage [v] input offset voltage [mv] 0 10 20 30 40 50 60 70 80 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] low - level sink current [a] 3v 5v 15v 0 10 20 30 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output sink current [ma] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 17/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 ba2902yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. 0 10 20 30 40 50 0 5 10 15 20 25 30 35 supply voltage [v] input bias current [na] figure 41. input bias current vs ambient temperature (vcc=30v, v icm =28v, e k =-1.4v) figure 38. input offset voltage vs ambient temperature (v icm =0v, e k =-1.4v) figure 39. input bias current vs supply voltage (v icm =0v, e k =-1.4v) figure 40. input bias current vs ambient temperature (v icm =0v, e k =-1.4v) 3v 5v 125 -40 25 -10 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input bias current [na] -8 -6 -4 -2 0 2 4 6 8 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input offset voltage [mv] 36v 3v 5v 32v 36v 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input bias current [na] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 18/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 ba2902yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. -10 -5 0 5 10 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input offset current [na] -10 -5 0 5 10 0 5 10 15 20 25 30 35 supply voltage [v] input offset current [na] -8 -6 -4 -2 0 2 4 6 8 - 1012345 input voltage [v] input offset voltage [mv] figure 43. input offset current vs supply voltage (v icm =0v, e k =-1.4v) figure 42. input offset voltage vs input voltage (vcc=5v) figure 44. input offset current vs ambient temperature (v icm =0v, e k =-1.4v) figure 45. large signal voltage gain vs supply voltage (r l =2k ? ) -40 25 125 3v 5v 60 70 80 90 100 110 120 130 140 4 6 8 10 12 14 16 supply voltage [v] large signal voltage gain [db] -40 25 125 36v -40 25 125 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 19/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 ba2902yf-lb (*)the above data is measurement value of typical sample, it is not guaranteed. 40 60 80 100 120 140 01 02 03 04 0 supply voltage [v] common mode rejection ratio [db] 40 60 80 100 120 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] common mode rejection ratio [db] figure 46. large signal voltage gain vs ambient temperature (r l =2k ? ) figure 47. common mode rejection ratio vs supply voltage figure 48. common mode rejection ratio vs ambient temperature figure 49. power supply rejection ratio vs ambient temperature -40 125 25 5v 3v 32v 36v 60 70 80 90 100 110 120 130 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] large signal voltage gain [db] 5v 15v 60 70 80 90 100 110 120 130 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] power supply rejection ratio [db] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 20/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically equal to the maximum storage temperature. the heat generated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 50 (a) shows the model of the thermal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax t a ) / p d c/w the derating curve in figure 50 (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 50(c) and 50(d) shows an example of the derating curve for ba2904yf-lb, ba2902yf-lb. (note14) (note15) unit 6.2 4.5 mw/c when using the unit above t a =25c, subtract the value above per celsius degree . mounted on a fr4 glass epoxy board 70mm70mm 1.6mm (copper foil area less than 3%) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] figure 50. thermal resistance and derating (c) ba2904yf-lb (d) ba2902yf-lb 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] ba2904yf-lb (note 14) ba2902yf-lb (note 15) figure 89. thermal resistance and derating curve 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi (b) derating curve a mbient temperature ta [ c ] chip surface temperature tj[ c ] (a) thermal resistance ja=(tjmax-ta)/pd c/w downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 21/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 application information null method condition for test circuit1 vcc, vee, e k , v icm unit: v parameter v f s1 s2 s3 vcc vee e k v icm calculation input offset voltage v f1 on on off 5 to 30 0 -1.4 0 1 input offset current v f2 off off off 5 0 -1.4 0 2 input bias current v f3 off on off 5 0 -1.4 0 3 v f4 on off large signal voltage gain v f5 on on on 15 0 -1.4 0 4 v f6 15 0 -11.4 0 common-mode rejection ratio (input common-mode voltage range) v f7 on on off 5 0 -1.4 0 5 v f8 5 0 -1.4 3.5 power supply rejection ratio v f9 on on off 5 0 -1.4 0 6 v f10 30 0 -1.4 0 - calculation - 1. input offset voltage (v io ) 2. input offset current (i io ) 3. input bias current (i b ) 4. large signal voltage gain (a v ) 5. common-mode rejection ration (cmrr) 6. power supply rejection ratio (psrr) figure 51. test circuit1 (one channel only) [db] v-v )/r r+(1 v log 20 cmrr f7 f8 sf icm ? [db] v- v )/r r+(1 vcc log 20 psrr f9 f10 sf ? v io |v f1 | = 1+r f /r s [v] |v f5 -v f6 | a v = e k (1+r f /r s ) [db] 20log = i b |v f4 -v f3 | 2 r i (1+r f /r s ) [a] i io |v f2 -v f1 | r i (1+r f /r s ) [a] = v icm r s =50 ? r s =50 ? r f =50k ? r i =10k ? r i =10k ? sw1 sw2 50k ? sw3 r l 0.1 f e k 500k ? 500k ? 1000pf v f 0.1 f 15v -15v vcc vee vo v null dut downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 22/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 switch condition for test circuit 2 sw no. sw 1 sw 2 sw 3 sw 4 sw 5 sw 6 sw 7 sw 8 sw 9 sw 10 sw 11 sw 12 sw 13 sw 14 supply current off off off on off on off off off off off off off off maximum output voltage (high) off off on off off on off off on off off off on off maximum output voltage (low) off off on off off on off off off off off off on off output source current off off on off off on off off off off off off off on output sink current off off on off off on off off off off off off off on slew rate off off off on off off off on on on off off off off gain bandwidth product off on off off on on off off on on off off off off equivalent input noise voltage on off off off on on off off off off on off off off figure 52. test circuit 2 (each op-amp) figure 53. slew rate input waveform figure 54. test circuit 3(channel separation) 40db amplifier 40db amplifier vcc vee r1 v r2 r1//r2 out1 =0.5vrms in vcc vee r1 v r2 r1//r2 out2 other ch cs=20 log 100 out1 out2 (r1=1k ? , r2=100k ? ) vh vl input wave t input voltage vh vl t v output wave sr v/ t t output voltage 90% 10% c c sw4 sw2 sw3 sw10 sw12 sw13 sw9 sw6 sw7 sw8 c l sw14 sw5 r1=1k ? r2 r l vee vcc v out v in- v in+ sw1 r s sw11 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 23/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in t he ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current gnd traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the gnd tr aces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capa citance, power wiring, width of gnd wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 24/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 vcc vee v icm - + operational notes C continued 11. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. nn p + p nn p + p substrate parasitic element gnd n p + nn p + n p p substrate gnd gnd parasitic element pin a pin a pin b pin b bc e parasitic element gnd parasitic element or transistor parasitic element c be transistor (npn) resistor figure 55. example of monolithic ic structure 12. unused circuits when there are unused circuits it is recommended that they be connected as in figure 56, setting the non-inverting input terminal to a potential within the in-phase input voltage range (v icm ). figure 56. disable circuit example 13. input terminal voltage (ba2904 / ba2902) applying vee + 36v to the input terminal is possible without causing de terioration of the electrical characteristics or destruction, irrespective of the supply vo ltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 14. power supply (signal / dual) the op-amp operates wh en the specified voltage suppl ied is between vcc and vee. therefore, the single supply op-amp can be used as a dual supply op-amp as well. 15. terminal short-circuits when the output and vcc terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 16. ic handling applying mechanical stress to the ic by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. keep this potential in v icm downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 25/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 physical dimensions tape and reel information package name sop8 max 5.35 (include. burr) drawing: ex112-5001-1 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 26/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 physical dimension tape and reel information - continued package name sop14 (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200690-1-2 ?2014 rohm co., ltd. all rights reserved. 27/27 tsz22111 ? 15 ? 001 ba2904yf-lb ba2902yf-lb 30.jan.2014 rev.001 marking diagrams land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 sop8 sop14 1.27 4.60 1.10 0.76 revision history date revision changes 30.jan.2014 001 new release product name package type marking ba2904y f-lb sop8 2904y ba2902y f-lb sop14 ba2902yf sop8 (top view) part number marking lot number 1pin mark sop14 (top view) part number marking lot number 1pin mark sop8, ssop-b8, msop8, sop14, ssop-b14 mie ? 2 b 2 e downloaded from: http:///
datasheet datasheet notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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